Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability – will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Specifications
Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance 2.5
Evaporation: <0.001 %
Volatility: 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 C
Operating Temperature: -50 240 C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%