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    Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

    Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance <0.205 C-in2 / W Density: > 2.5 Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1 Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 C Operating Temperature: -50 240 C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%
    Proizvođač: Gembird
    Jedinstvena šifra artikla: 29364
    Dostupnost: Na stanju
    7,50 KM

    Tip Termalna Pasta

    Thermal compund (grease) for heatsinks
    Helps the heat dissipation from a CPU, chipset or processor to a heatsink
    Excellent thermal impedance
    Perfect stability - will not separate, run, migrate, or bleed
    Non capacitive or electrically conductive
    Specifications
    Weight: 1.5 g
    Color: grey
    Thermal conductivity: > 4.5 W / mK
    Thermal Impedance <0.205  C-in2 / W
    Density: > 2.5
    Evaporation: <0.001 %
    Volatility: <0.005 %
    The dielectric constant: > 5.1
    Dissipation Factor: <0.005
    Viscosity: 76 CPS
    Thixotropic index: 310 ± 10  C
    Operating Temperature: -50  240  C
    Composites: 50% silicone compounds
    Compounds: 30% of carbon
    The compounds of metal oxides: 20%