Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Specifications
Weight: 1.5 g
Color: grey
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 C
Operating Temperature: -50 240 C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
The IC Value V1 is a high performance thermal compound with high thermal conductivity and low thermal resistance. It can prevent your pc components from short circuit incidence due to its traits of non-curing and non-electrical conductive.
The IC Essential E1 is a high performance thermal compound to meet the requirements of mainstream CPU cooling. With its low thermal impedance and appropriate viscosity, IC Essential E1 can provide very efficient heat transfer and can be spread easily and evenly. It"s also bundled with a grease cleanser that allows you to easily clean old thermal grease away.
The Hyper TX3 EVO cooling system is designed and optimized to provide the best user experience and cooling potential for a new generation of processors.CPU SOCKET LGA1366, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, LGA775, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1.DIMENSIONS (L X W X H) 90 x 79 x 136 mm / 3.5 x 3.1 x 5.4 inch
Hyper H412R je pristupačan, kompaktan hladnjak zraka visokih performansi koji se odlično uklapa u sistem malih faktora. Sa 4 toplotne cijevi i tehnologijom Direct Contact, ovaj model nadmašuje svoju prethodnu seriju Hyper TX3. Poseban dizajn peraje optimizira protok zraka prema toplotnim cijevima. 92 mm PWM ventilator ima širok raspon brzina ventilatora i može se podesiti radi maksimalnog protoka zraka i hlađenja ili tihog rada. CPU SOCKET LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1151, LGA1155, LGA1156, LGA1366, LGA775, LGA1150, AM4, AM3+, AM3, AM2+, FM2+, FM2, FM
Based on the Freezer 7 Pro, the Freezer i11 has been improved airflow, cooling performance, noise level and transport-proofness. Whether you are an expert at installing electronics or this is your first time; the Freezer i11 is just a few minutes away from being installed.
Hyper TX serija je evoluirala zajedno sa zahtevima glavnih procesora. Lansiranje Hyper TX3 EVO označava još jednu prekretnicu s poboljšanom tehnologijom Direct Contact kompanije Cooler Master, poboljšavajući performanse hlađenja.CoolerMaster Hyper TX3i EVO, Intel LGA 1156/1155/1151/1150/775, 92mm fan, 800-2200rpm, 17-30dB, 4-pin (RR-TX3E-22PK-B1)
CPU hladnjak Cooler Master Hyper 212s RGB, Black Edition. Legendarni Hyper hladnjak zraka vratio se i bolji nego prije. Hyper 212 RGB Black Edition nudi bolju ugradnju i odlične performanse, lako jedno od najboljih rješenja za hlađenje zrakom. Aluminijski gornji poklopac i crne peraje sa niklom pozlaćene, daju Hyper 212 RGB Black Edition vrhunsku estetsku privlačnost. Elegantna crna mlaznica ne samo da čini sjajno, već i povećava performanse hlađenja. CPU SOCKET
LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1151, LGA1150, LGA1156, LGA1155, LGA1366, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1
High performance Copper heatpipes with a fusion bonded copper powder wick.
Patented CDC™ technology – 4 direct touch heatpipes creating a gap-less contact surface
Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation.
4th Generation Bearing – MTBF of 160,000 hours thanks to highly durable POM components.
Redesigned Fan-blades that create vortices to boost airflow without creating more noise.
Smart Fan engine – stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared.
Universal mounting system for all Intel and AMD platforms.CPU SOCKETLGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, AM4, AM3+, AM3, AM2+, FM2+, FM2, FM1
Dimensions radiator (l x w x d): 274 x 120 x 27 mm
Dimensions fan (l x w x d): 120 x 120 x 25 mm
Dimensions heat sink (l x w x d): 52 x 58 x 38 mm
Dimensions copper plate (l x w): 52 x 58 mm
Weight (retail): 1,635 kg
Weight (cooler + fan): 0,907 kg
Rated voltage: 12V DC
Starting voltage: 6V
Operating voltage range: 10 - 14V
Rated current: 0,22A (0,26A max.)
Input power: 3W
Fan speed: 800 - 2200 rpm (+/- 10%)
Air flow: 20,13 - 86,5 CFM (+/- 10%)
Air pressure: 4,51 - 37,26 Pa
Fan noise level: 19-35 dB(A) max.
Pump noise level: <25 dB(A) max.
Bearing: FDB - Fluid Dynamic Bearing
Fan connector: 4 pin PWM
Cooler connector: 3 pin
TDP (Thermal Design Power): 300W
Fan cable length: each ca. 30 cm
Tube length: each ca. 31 cm
Number of fan wings: each 7 wings
